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Panasonic Corporation builded a virtual private network consisting of a private telephone network using sXGP base stations with a 5G core network and a public LTE network, and conducted a demonstration experiment with the purpose of developing new services for building tenants and facilities.

Panasonic Corporation has commercialized a semiconductor package substrate material enabling both low package warpage and high assembly-level reliability. The newly developed material has very low thermal expansion properties to reduce warping of the substrate during the packaging process.

Zero Emissions Target Highlights Approach since Enactment of Matsushita Environmental Charter 30 years ago